ECM - École Centrale de Marseille : UMR7249 (Pôle de l'étoile - Technopole de Château-Gombert - 38 rue Frédéric Joliot-Curie - 13013 Marseille - France)
Abstract : The electromagnetic dual-primal finite element tearing and interconnecting (FETI-DPEM) method is a nonoverlapping domain decomposition method developed for the finite element analysis of large-scale electromagnetic problems, where the corner edges are globally numbered. This paper presents an extension of the FETI-DPEM2 method, named FETI-full dual primal (FETI-FDP2), where more flexible Robin-type boundary conditions are imposed, on the inner interfaces between subdomains as well as on the corner edges, leading to a new interface problem. Its capacities are tested in the framework of a three-dimensional (3-D) free-space scattering problem, with a scattered field formulation and a computational domain truncated by perfectly mathed layers (PML). First, we compare its accuracy with respect to other FETI-DPEM2 methods and to a complete resolution of the FEM problem, thanks to a direct sparse solver. We show that the convergence of iterative solvers is affected by the presence of the PML and can be accelerated by means of a more accurate approximation, between adjacent subdomains, of the Dirichlet-to-Neumann (DtN) operator. The effectiveness of the iterative solvers are also considered for different test cases. The advantages of the proposed FETI-FDP2 method combined with the associated DtN approximation is numerically demonstrated, regardless the chosen working frequency or the iterative solvers.
https://hal-amu.archives-ouvertes.fr/hal-01279552
Contributor : Amelie Litman <>
Submitted on : Monday, November 5, 2018 - 11:30:54 AM Last modification on : Thursday, January 23, 2020 - 6:22:15 PM Long-term archiving on: : Wednesday, February 6, 2019 - 2:35:34 PM
Ivan Voznyuk, Hervé Tortel, Amelie Litman. 3-D Electromagnetic Scattering Computation in Free-Space With the FETI-FDP2 Method. IEEE Transactions on Antennas and Propagation, Institute of Electrical and Electronics Engineers, 2015, 63 (6), pp.2604 - 2613. ⟨10.1109/TAP.2015.2417977⟩. ⟨hal-01279552⟩