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Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction

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https://hal-amu.archives-ouvertes.fr/hal-01454838
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Submitted on : Friday, February 3, 2017 - 9:43:35 AM
Last modification on : Wednesday, November 3, 2021 - 7:28:36 AM

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  • HAL Id : hal-01454838, version 1

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B. Vianne, S. Escoubas, M.I. Richard, V. Fiori, A. Farcy, et al.. Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction. 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation, May 2016, Dresden, Germany. ⟨hal-01454838⟩

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