Skip to Main content Skip to Navigation
Conference papers

Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction

Complete list of metadatas

https://hal-amu.archives-ouvertes.fr/hal-01454838
Contributor : Im2np Bibliométrie <>
Submitted on : Friday, February 3, 2017 - 9:43:35 AM
Last modification on : Wednesday, May 16, 2018 - 3:04:02 PM

Identifiers

  • HAL Id : hal-01454838, version 1

Collections

Citation

B. Vianne, S. Escoubas, M.I. Richard, V. Fiori, A. Farcy, et al.. Effect of the temperature on the strain distribution induced in SOI photonic substrate by copper filled TSVs, using advanced scanning X-ray nano- diffraction. 14th International Conference Reliability and Stress-Related Phenomena in Nanoelectronics–Experiment and Simulation, May 2016, Dresden, Germany. ⟨hal-01454838⟩

Share

Metrics

Record views

208