. Antutu, AnTuTu Benchmark -Android Apps on Google Play, 2019.

O. Djedidi, M. A. Djeziri, and N. K. Sirdi, Data-Driven Approach for Feature Drift Detection in Embedded Electronic Devices, IFACPapersOnLine, vol.51, issue.24, pp.1024-1029, 2018.
URL : https://hal.archives-ouvertes.fr/hal-01869747

O. Djedidi, M. A. Djeziri, N. K. Sirdi, and A. Naamane, Modular Modelling of an Embedded Mobile CPU-GPU Chip for Feature Estimation, Proceedings of the 14th International Conference on Informatics in Control, Automation and Robotics, vol.1, pp.338-345, 2017.
URL : https://hal.archives-ouvertes.fr/hal-01770233

F. Faggin, M. E. Hoff, S. Mazor, and M. Shima, History of the 4004, IEEE Micro, vol.16, issue.6, pp.10-20, 1996.

, Freescale Semiconductor Inc. , 2012a. i.MX 6 Series Thermal Management Guidelines

, Freescale Semiconductor Inc. , 2012b. i.MX 6SoloX Automotive and Infotainment Applications Processors -Data Sheet. Freescale Semiconductor

, Benchmark -Android Apps on Google Play

I. D. Landau and G. , System Identification: The Bases BT -Digital Control Systems: Design, Identification and Implementation, pp.201-245, 2006.

I. D. Landau, N. Sirdi, and M. Saad, Techniques de modélisation récursive pour l'analyse spectrale paramétrique adaptative, vol.3, pp.183-204, 1986.

T. Li, G. Yu, and J. Song, Minimizing energy by thermal-aware task assignment and speed scaling in heterogeneous MPSoC systems, Journal of Systems Architecture, vol.89, pp.118-130, 2018.

A. Löfwenmark and S. Nadjm-tehrani, Fault and timing analysis in critical multi-core systems: A survey with an avionics perspective, Journal of Systems Architecture, vol.87, pp.1-11, 2018.

P. Mercati, F. Paterna, A. Bartolini, L. Benini, and T. ?. Rosing, WARM: Workload-Aware Reliability Management in Linux/Android, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol.36, issue.9, pp.1557-1570, 2017.

L. Niu and D. Zhu, Reliability-aware scheduling for reducing system-wide energy consumption for weakly hard real-time systems, Journal of Systems Architecture, vol.78, pp.30-54, 2017.

. Thales, 2017. What is new on Avionics 2020? | Thales Aerospace BlogThales Aerospace Blog

K. J. Wang, H. C. Sun, and Z. L. Pan, An analytical thermal model for Three-Dimensional integrated Circuits with integrated micro-channel cooling, Thermal Science, vol.21, issue.4, pp.1601-1606, 2017.

J. Zhou, J. Yan, K. Cao, Y. Tan, T. Wei et al., Thermal-aware correlated two-level scheduling of real-time tasks with reduced processor energy on heterogeneous MPSoCs, Journal of Systems Architecture, vol.82, pp.1-11, 2018.