Formation and stability of a two-dimensional nickel silicide on Ni(111): An Auger, LEED, STM, and high-resolution photoemission study
Abstract
Using low-energy electron diffraction (LEED), Auger electron spectroscopy (AES), scanning tunneling microscopy (STM), and high-resolution photoelectron spectroscopy (HR-PES) techniques we have studied the annealing effect of one silicon monolayer deposited at room temperature onto a Ni (111) substrate. The variations of the Si surface concentration, recorded by AES at 300 degrees C and 400 degrees C, show at the beginning a rapid Si decrease followed by a slowing down up to a plateau equivalent to about one third of a silicon monolayer. STM images and LEED patterns, both recorded at room temperature just after annealing, reveal the formation of an ordered hexagonal superstructure of (root 3 x root 3)R30 degrees type. From these observations and from a quantitative analysis of HR-PES data, recorded before and after annealing, we propose that the (root 3 x root 3)R30 degrees superstructure corresponds to a two-dimensional Ni2Si surface silicide.