Contactless measurement of bulk lifetime and surface recombination velocity in silicon wafers

O. Palais; A. Arcari

doi:10.1063/1.1562741

Journal Articles Journal of Applied Physics Year : 2003

Contactless measurement of bulk lifetime and surface recombination velocity in silicon wafers

(1) ,

1

O. Palais

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Institut des Matériaux, de Microélectronique et des Nanosciences de Provence

A. Arcari

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Physics [physics]

Olivier Palais : Connect in order to contact the contributor

https://hal-amu.archives-ouvertes.fr/hal-03350302

Submitted on : Tuesday, September 21, 2021-11:15:20 AM

Last modification on : Tuesday, October 19, 2021-10:50:07 PM

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hal-03350302 , version 1 (21-09-2021)

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HAL Id : hal-03350302 , version 1
DOI : 10.1063/1.1562741

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O. Palais, A. Arcari. Contactless measurement of bulk lifetime and surface recombination velocity in silicon wafers. Journal of Applied Physics, 2003, 93 (8), pp.4686-4690. ⟨10.1063/1.1562741⟩. ⟨hal-03350302⟩

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Contactless measurement of bulk lifetime and surface recombination velocity in silicon wafers

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