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Effect of sulphur content and pre-annealing treatments on nickel grain-boundary diffusion in high-purity copper

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https://hal-amu.archives-ouvertes.fr/hal-02045048
Contributor : Christophe Girardeaux <>
Submitted on : Thursday, February 21, 2019 - 5:48:30 PM
Last modification on : Tuesday, March 30, 2021 - 3:23:29 AM

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  • HAL Id : hal-02045048, version 1

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Zs. Tôkei, Z. Erdélyi, Christophe Girardeaux, A. Rolland. Effect of sulphur content and pre-annealing treatments on nickel grain-boundary diffusion in high-purity copper. Philosophical Magazine a, Informa UK (Taylor & Francis), 2000, 80 (5), pp.1075-1083. ⟨hal-02045048⟩

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