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Conference papers

Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes

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https://hal-amu.archives-ouvertes.fr/hal-02111108
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Submitted on : Thursday, April 25, 2019 - 5:50:52 PM
Last modification on : Wednesday, November 3, 2021 - 7:28:58 AM

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  • HAL Id : hal-02111108, version 1

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S. Mhira, V. Huard, D. Arora, P. Flatresse, A. Bravaix. Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes. IEEE International Reliability Physics Symposium, (IRPS), Mar 2018, Burlingame, California, United States. pp.3D.1-1, 3D.1-7. ⟨hal-02111108⟩

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