Skip to Main content Skip to Navigation
Conference papers

Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes

S. Mhira V. Huard D. Arora P. Flatresse A. Bravaix 1
1 IM2NP - Institut des Matériaux, de Microélectronique et des Nanosciences de Provence
Document type :
Conference papers
Complete list of metadata
https://hal-amu.archives-ouvertes.fr/hal-02111108
Contributor : Im2np Bibliométrie <>
Submitted on : Thursday, April 25, 2019 - 5:50:52 PM
Last modification on : Tuesday, March 30, 2021 - 3:23:38 AM

Identifiers

  • HAL Id : hal-02111108, version 1

Collections

UNIV-AMU | CNRS | IM2NP | UNIV-TLN

Citation

S. Mhira, V. Huard, D. Arora, P. Flatresse, A. Bravaix. Resilient Automotive Products through Process, Temperature and Aging Compensation Schemes. IEEE International Reliability Physics Symposium, (IRPS), Mar 2018, Burlingame, California, United States. pp.3D.1-1, 3D.1-7. ⟨hal-02111108⟩

Export

BibTeX TEI DC DCterms EndNote

Share

Metrics

Record views

64